Optimizing temperature gradient for rapid fabrication of Cu/Sn/Cu full intermetallic compounds joints via vacuum thermal compression bonding-Reference-Cited by-同舟云学术

Optimizing temperature gradient for rapid fabrication of Cu/Sn/Cu full intermetallic compounds joints via vacuum thermal compression bonding

Published:2024-04 Issue:12 Volume:35 Page:
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Chen Chen,Zhang Liang^ORCID,Guo Xing-Yu,Zhang Jia-Min,Huang Xi

Funder

High Level Talent Research Initiation Project of Xiamen University of Technology

Fujian Provincial “Minjiang Scholar” Distinguished Professor Talent Plan Project

Natural Science Foundation of Jiangsu Province

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s10854-024-12604-6.pdf

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