Microstructure characterization and mechanical behavior for Ag3Sn joint produced by foil-based TLP bonding in air atmosphere-Reference-Cited by-同舟云学术

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Microstructure characterization and mechanical behavior for Ag3Sn joint produced by foil-based TLP bonding in air atmosphere

Published:2017-01 Issue: Volume:680 Page:221-231
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Shao Huakai.,Wu Aiping,Bao Yudian,Zhao Yue,Zou Guisheng

Funder

National Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference28 articles.

1. Die Attach Materials For High Temperature Applications: A Review,;Manikam;IEEE Trans. Compon. Packag. Manuf. Technol.,2011

2. High-temperature electronics-a role for wide bandgap semiconductors? P;Neudeck;IEEE,2002

3. Reliability investigation of Cu/In TLP bonding;Lee;J. Electron. Mater.,2015

4. Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol;Tan;Appl. Phys. Lett.,2009

5. Mechanical properties of nano-silver joints as die attach materials;Siow;J. Alloy. Compd.,2012

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