Author:
Xu L. Y.,Zhang Z. K.,Jing H. Y.,Wei J.,Han Y. D.
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference31 articles.
1. F. Rosalbino, E. Angelini, G. Zanicchi, R. MarazzaE, Corrosion behaviour assessment of lead-free Sn–Ag–M (M = In, Bi, Cu) solder alloys. J. Electron. Mater. 109, 386–391 (2008)
2. Y. Li, K. Moon, C.P. Wong, Electronics without lead. Science 308, 1419–1420 (2005)
3. I.E. Anderson, Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications. J. Mater. Sci. Mater. Electron. 18, 55–76 (2007)
4. C.M.L. Wu, D.Q. Yu, C.M.T. Law, L. Wang, Properties of lead-free solder alloys with rare earth element additions. Mater. Sci. Eng., R 44, 1–44 (2004)
5. Y.D. Han, H.Y. Jing, S.M.L. Nai, C.M. Tan, J. Wei, L.Y. Xu, S.R. Zhang, A modified constitutive model for creep of Sn–3.5Ag–0.7Cu solder joints. J. Phys. D Appl. Phys. 42, 125411 (2009)
Cited by
25 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献