Fatigue Crack Propagation in Lead-Free Solder under Mode I and II Loading-Reference-Cited by-同舟云学术

Fatigue Crack Propagation in Lead-Free Solder under Mode I and II Loading

Published:2009 Issue:760 Volume:75 Page:1738-1745
ISSN:0387-5008
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
language:en
Short-container-title:Trans.JSME, Ser.A

Author:

TANAKA Keisuke¹,IWATA Yoshifumi,AKINIWA Yoshiaki

Affiliation:

1. Department of Mechanical Engineering, Meijo University

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

https://www.jstage.jst.go.jp/article/kikaia1979/75/760/75_KJ00005928685/_pdf

Reference16 articles.

1. 1) MUKAI M. Damage Path Simulation of Solder Bumps Under Mechanical Fatigue Tests. Transactions of the Japan Society of Mechanical Engineers, Series A. (2007) vol.73, no.736, p.1341-1343.

2. 2) The Society of Materials Science Japan. Standard for Low Cycle Fatigue Tests of Solder. JSMS-SD-3-00. Society of Materials Science. (2000)

3. 3) RICE J. R. Some Further Results of J-Integral Analysis and Estimate. Progress in Flaw Growth and Fracture Toughness Testing. American Society for Testing and Materials. (1973) p.231-245.

4. 4) DOWLING. Geometry Effects and J Integral Approach to Elastic Plastic Fatigue Crack Growth. Mechanics of Crack Growth. American Society for Testing and Materials. (1976) p.82-103.

5. 5) TADA H. The Stress Analysis of Cracks Handbook. ASM International Publication. (2000) vol.41,

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