Damage Path Simulation of Solder Bumps Under Mechanical Fatigue Tests-Reference-Cited by-同舟云学术

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Damage Path Simulation of Solder Bumps Under Mechanical Fatigue Tests

Published:2007 Issue:736 Volume:73 Page:1431-1437
ISSN:0387-5008
Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
language:en
Short-container-title:Trans.JSME, Ser.A

Author:

MUKAI Minoru¹,MONDA Tomoko¹,HIROHATA Kenji¹,TAKAHASHI Hiroyuki¹,KAWAKAMI Takashi¹

Affiliation:

1. Corporate Research & Development Center, Toshiba Corporation

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://www.jstage.jst.go.jp/article/kikaia1979/73/736/73_736_1431/_pdf

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fatigue Crack Propagation in Lead-Free Solder under Mode I and II Loading;TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A;2009

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