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Creep-Fatigue Crack Propagation in Lead-Free Solder under Various Strain Waveforms

  • Published:2011 Issue:775 Volume:77 Page:402-414
  • ISSN:0387-5008
  • Container-title:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
  • language:en
  • Short-container-title:Trans.JSME, Ser.A

Author:

TANAKA Keisuke1,SAKAI Ryota,HIRASAWA Takuya,SAKAGAWA Yusuke,FUJIYAMA Kazunari1

Affiliation:

1. Meijo Univ. Dept. of Mechanical Engineering

Publisher

Japan Society of Mechanical Engineers

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference14 articles.

1. Evaluation of Strain-Rate-Dependent Fatigue-crack Propagation in 60 Sn/40 Pb Solder.

2. Evaluation of Creep-Fatigue Crack Propagation of Sn-37 Pb Solder.

3. (3) 能瀬春雄,坂根政男,山下満男,塩川国夫,"鉛系および非鉛系はんだの引張.圧縮疲労き裂の進展挙動",日本機械学会論文集(A編), Vol. 68, No. 665 (2003), pp. 88-95.

4. Fatigue Crack Propagation in Lead-Free Solder under Mode I and II Loading

5. Effect of Load Waveform on Creep-Fatigue Crack Propagation in Lead-Free Solder

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