Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder-Reference-Cited by-同舟云学术

Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder

Published:2009 Issue:3 Volume:3 Page:507-517
ISSN:1880-9871
Container-title:Journal of Solid Mechanics and Materials Engineering
language:en
Short-container-title:JMMP

Author:

ZHANG Shengde¹,OGAWA Shinsuke²,SAKANE Masao¹

Affiliation:

1. Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University

2. Department of Mechanical Engineering, Graduate School, Ritsumeikan University

Publisher

Japan Society of Mechanical Engineers

Link

http://www.jstage.jst.go.jp/article/jmmp/3/3/3_3_507/_pdf

Reference14 articles.

1. III : Thermo-Mechanical Fatigue in Electronic Devices

2. Creep Rupture Investigation of 63Sn-37Pb Solder by Experiments and Damage Mechanics

3. (3) Kanchanomai, C., Miyashta, Y., and Mutoh, Y., Low Cycle Fatigue Behavior and Mechanisms of a Eutectic Sn-Pb Solder 63Sn/37Pb, International Journal of Fatigue, Vol. 24, No. 6 (2002), pp. 671-683.

4. (4) Knecht, S., and Fox, L. R., Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder, IEEE Transactions on Manufacturing Technology, Vol. 13, No. 2 (1990), pp. 424-433.

5. Creep rupture of lead-free Sn-3.5Ag-Cu solders

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Investigation of Effect of Creep Strain on Low-Cycle Fatigue of Lead-Free Solder by Cyclic Loading Using Stepped Ramp Waves;Journal of Electronic Packaging;2010-12-01

2. Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves;Journal of Electronic Packaging;2010-11-23