1. 1) S. Taira, “Thermal Stress and Thermal Fatigue” (1974) Japan Industrial Publishing Co., LTD, Tokyo.
2. 2) Y. Takeuchi, “Analyses of Thermal Stresses” (1971) Nissin Publishing Co., LTD, Tokyo.
3. Fatigue Life Analysis of Solder Joints in Flip Chip Bonding
4. 4) JSMS Committee on High Temperature Strength of Materials, “JSMS Report Inelastic Constitutive Model for Solders” The Society of Materials Science, Japan (2004).
5. 5) Y. Tsukada, “An Experimental Study of Creep-Fatigue for Sn-37Pb in Flip Chip Bonding” Doctoral Thesis, Ritsumeikan University, p.39 (2005).