Effect of Silica Filler on Creep Characteristics of Polyamide Resin Thin Films
Author:
Affiliation:
1. Science and Technology Research Institute, Ritsumeikan University
2. Present: Japan Atomic Energy Agency
3. Department of Mechanical Engineering, College of Science of Engineering, Ritsumeikan University
Publisher
Japan Institute of Electronics Packaging
Subject
Electrical and Electronic Engineering
Link
https://www.jstage.jst.go.jp/article/jiep/19/3/19_170/_pdf
Reference16 articles.
1. 1) Y. Tsukada: “Introduction of build-up printed circuit board,” The Nikkan Kogyo Shinbun, LTD., 1998
2. 2) M. Sakane: “New challenges for thermo-mechanical fatigue III: Thermo-mechanical fatigue in electronic devices,” Journal of the Society of Materials Science, Japan, Vol. 56, No. 3, pp. 302-308, 2007
3. 3) S. Lee, H. Yang, H. Kim, C. Jeong, B. Lim, and J. Lee: “Creep behavior and manufacturing parameters of wood flour filled polypropylene composites,” Composite Structures, Vol. 65, No. 3-4, pp. 459-469, 2004
4. 4) H. Kanayama, S. Zhang, M. Sakane, T. Nagasawa, and K. Kobayashi: “Creep characteristics of liquid crystal polymer film,” Journal of the Society of Materials Science, Japan, Vol. 59, No. 8, pp. 645-652, 2010
5. 5) Y. Hirai, Y. Maruyama, and S. Somiya: “The effect of the crystallization on creep behavior for glass fiber reinforced polyamide,” The 12th Materials and Processing Conference (M&P2004), No. 4-15, pp. 125-126, The Japan Society of Mechanical Engineering, 2004
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