Author:
KANAYAMA Hideyuki,ZHANG Shengde,SAKANE Masao,NAGASAWA Tadashi,KOBAYASHI Kaoru
Publisher
Society of Materials Science, Japan
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference18 articles.
1. 1) Y. Tsukada, “Introduction of build-up printed circuit board” (1998) The Nikkan Kogyo Shinbun, LTD.
2. III : Thermo-Mechanical Fatigue in Electronic Devices
3. High‐performance substrate from new epoxy resin and enhanced copper foil
4. 5) N. Koide and K. Sakamoto, “Liquid crystal polymer” (1988) Kyoritsu Shuppan Co., LTD.
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1 articles.
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