Fatigue Life Analysis of Solder Joints in Flip Chip Bonding-Reference-Cited by-同舟云学术

Fatigue Life Analysis of Solder Joints in Flip Chip Bonding

Published:1999-11-01 Issue:3 Volume:122 Page:207-213
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Tsukada Yutaka¹,Nishimura Hideo¹,Sakane Masao²,Ohnami Masateru²

Affiliation:

1. Yasu Technology Application Laboratory, IBM, 800 Ichimiyake, Yasu-cho, Yasu-gun, Shiga-ken 520-23 Japan

2. Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University, 1916 Noji-cho, Kusatsu-shi, Shiga-ken 525 Japan

Abstract

This paper describes the life assessment of flip chip joints. Flip chip joints of 63Sn-37Pb and 5Sn-95Pb solders on a printed circuit board were stressed thermally for fatigue. Fatigue lives of the joints were determined by an electrical potential drop method and the effect of encapsulation on fatigue life was discussed. The encapsulation had a significant effect of prolonging the fatigue life of the joints. Thermo-mechanical finite element analyses proved that the encapsulation lowered the strain amplitude of the joints by distributing the strain over a whole package and bending effect. Cracking location was also discussed in relation with the strain concentration in the joints. Fatigue lives of the flip chip joints were compared with those of bulk round bar specimens and the difference in fatigue life between two types of specimens was discussed from the specimen dimensions and ratchet effect. [S1043-7398(00)00203-6]

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/122/3/207/5595315/207_1.pdf

Reference9 articles.

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3. Tsukada, Y., Mashimoto, Y., Nishio, T., and Mii, N., 1992, “Reliability and Stress Analysis of Encapsulated Flip Chip Joint on Epoxy Base Printed Circuit Board,” Proceedings of ASME/JSME Joint Conference for Advanced in Electronics Packaging, 2, pp. 827–835.

4. O’Malley, G., Giesler, J., and Machuga, S., 1994, “The Importance of Material Selection for Flip Chip on Board Assemblies,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 17, No. 3, pp. 248–255.

5. Giesler, J., O’Malley, G., Williams, M., and Machuga, S., 1994, “Flip Chip on Board Connection Technology: Process Characterization and Reliability,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 17, No. 3, pp. 256–263.

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