Evaluation of the thermal conductance of flip-chip bonding structure utilizing the measurement based on Fourier’s law of heat conduction at steady-state-Reference-Cited by-同舟云学术

Evaluation of the thermal conductance of flip-chip bonding structure utilizing the measurement based on Fourier’s law of heat conduction at steady-state

Published:2018-06 Issue:6 Volume:8 Page:065208
ISSN:2158-3226
Container-title:AIP Advances
language:en
Short-container-title:AIP Advances

Author:

Wu Chia-Yu¹,Huang Yin-Hsien¹,Wu Hsin-Han¹,Hsieh Tsung-Eong¹

Affiliation:

1. Department of Materials Science and Engineering, National Chiao Tung University, 1001 Ta-Hsueh Road, Hsinchu 30010, Taiwan, R.O.C.

Funder

Ministry of Science and Technology

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.5028318

Reference54 articles.

1. Solid Logic Technology: Versatile, High-Performance Microelectronics

2. Fatigue Life Analysis of Solder Joints in Flip Chip Bonding

3. Thermal Fatigue Behavior of Flip-chip Joints with Lead-free Solders

4. Electromigration Effects upon Interfacial Reactions in Flip-Chip Solder Joints

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of Silane Coupling Agents on the Underfill Adhesion undergoing Heat Aging Test;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

2. A Thermal Compensation Technique to Improve the Accuracy of Terahertz Power Measurements;2020 International Conference on Microwave and Millimeter Wave Technology (ICMMT);2020-09-20

3. Multilayered epoxy composites by a macroscopic anisotropic design strategy with excellent thermal protection;Journal of Materials Science;2020-07-20

4. Integrated circuit (IC)‐embedded wafer‐level packaging technology for millimeter‐wave power ICs;Microwave and Optical Technology Letters;2019-06-04