Creep Rupture Investigation of 63Sn-37Pb Solder by Experiments and Damage Mechanics
Author:
Publisher
ASTM International
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Creep-fatigue life assessment for three kinds of solders;Materials at High Temperatures;2012-12
2. Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder;Journal of Solid Mechanics and Materials Engineering;2009
3. The Connection between Microstructural Damage Modeling and Continuum Damage Modeling for Eutectic Sn-Pb Solder Alloys;International Journal of Damage Mechanics;2005-10
4. Creep-Fatigue Life Evaluation for Sn-3.5Ag Solder;Journal of Engineering Materials and Technology;2005-05-11
5. The mechanical properties of a joint of Sn-3.5Ag-1Zn solder and Cu substrate with aging treatment;Zeitschrift für Metallkunde;2005-02
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