Creep-Fatigue Life Evaluation for Sn-3.5Ag Solder-Reference-Cited by-同舟云学术

Creep-Fatigue Life Evaluation for Sn-3.5Ag Solder

Published:2005-05-11 Issue:2 Volume:128 Page:142-150
ISSN:0094-4289
Container-title:Journal of Engineering Materials and Technology
language:en
Short-container-title:

Author:

Nozaki Mineo¹,Sakane Masao²,Tsukada Yutaka³,Nishimura Hideo⁴

Affiliation:

1. Product Innovation Department, Hyogo Prefectural Institute of Technology, 3-1-12, Yukihira-cho, Suma-ku, Kobe, Hyogo, 654-0037, Japan

2. Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University, 1-1-1, Nojihigashi, Kusatu-shi, Shiga, 525-8577, Japan

3. KYOCERA SLC Technologies Corporation, 656, Ichimiyake, Yasu-cho, Yasu-gun, Shiga, 520-2362, Japan

4. IBM Japan, Ltd. Yasu, 800, Ichimiyake, Yasu-cho, Yasu-gun, Shiga, 520-2392, Japan

Abstract

This paper studies the creep-fatigue life evaluation of Sn-3.5Ag solder under push-pull loading using fast-fast, fast-slow, slow-fast, slow-slow, and strain-hold strain waves. Extensive creep-fatigue data were generated using these strain waves and the applicability of four conventional creep-fatigue damage rules, the linear damage rule, the frequency modified fatigue life, the ductility exhaustion model, and the strain range partitioning method, was examined. No conventional damage rules evaluated creep-fatigue lives accurately. Only the grain boundary sliding model, developed recently for solders, predicted creep-fatigue lives with a small scatter.

Publisher

ASME International

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

http://asmedigitalcollection.asme.org/materialstechnology/article-pdf/128/2/142/5565363/142_1.pdf

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