1. D.R. Frear, S.N. Burchett, and M.K. Neilsen: Proc. InterPack ’97, EEP series-vol. 19-2, Advances in Electronic Packaging, ASME, Fairfield, NJ, 1997, pp. 1515–27.
2. Y.-H. Pao, R. Govila, S. Badgley, and E. Jih: J. Electronic Packaging, 1993, vol. 115, pp. 1–8.
3. H.U. Akay, Y. Tong, and N. Paydar: J. Microcircuits Electronic Packaging, 1992, vol. 116, pp. 79–88.
4. D.R. Frear and W.B. Jones: Proc. NEPCON West ’90, Anaheim, CA, Cahners Exposition Group, Des Plaines, Ill, 1990, pp. 1324–52.
5. D. Tribula, D. Grivas, D.R. Frear, and J.W. Morris, Jr.: J. Electronic Packaging, 1989, vol. III:6, pp. 83–89.