Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

Abstract

Abstract This study presents a comprehensive assessment of the process-induced warpage of molded wafer for chip-first, face-down fan-out wafer-level packaging (FOWLP) during the fan-out fabrication process. A process-dependent simulation methodology is introduced, which integrates nonlinear finite element (FE) analysis and element death-birth technique. The effects of the cure-dependent volumetric shrinkage, geometric nonlinearity, and gravity loading on the process-induced warpage are examined. The study starts from experimental characterization of the temperature-dependent material properties of the applied liquid type epoxy molding compound (EMC) system through dynamic mechanical analysis (DMA) and thermal mechanical analysis. Furthermore, its cure state (heat of reaction and degree of cure (DOC)) during the compression molding process (CMP) is measured by differential scanning calorimetry (DSC) tests. Besides, the cure dependent-volumetric (chemical) shrinkages of the EMC system after the in-mold cure (IMC) and postmold cure (PMC) are experimentally determined by which the volumetric shrinkage at the gelation point is predicted through a linear extrapolation approach. To demonstrate the effectiveness of the proposed theoretical model, the prediction results are compared against the inline warpage measurement data. One possible cause of the asymmetric/nonaxisymmetric warpage is also addressed. Finally, the influences of some geometric dimensions on the warpage of the molded wafer are identified through parametric analysis.