Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin-Reference-Cited by-同舟云学术

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Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin

Published:2024-06 Issue: Volume:157 Page:115416
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Inamdar A.^ORCID,van Soestbergen M.,Mavinkurve A.,van Driel W.D.,Zhang G.Q.

Funder

Electronic Components and Systems for European Leadership

ECSEL

Publisher

Elsevier BV

Reference44 articles.

1. Arm partners have shipped 200 billion chips;Segars,2021

2. Semiconductor trends in automotive 2022;Yole Intelligence,2022

3. Medical electronics market size to hit USD 248.43 billion;Precedence Research,2021

4. AEC-Q100-Rev-H failure mechanism based stress test qualification for integrated circuits component technical committee automotive electronics council,2014

5. Thermal management of flip chip packages;Chu,2013

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Digital Twin Technology—A Review and Its Application Model for Prognostics and Health Management of Microelectronics;Electronics;2024-08-16

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