Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications-Reference-Cited by-同舟云学术

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Published:2016-03-01 Issue:1 Volume:138 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Zhang Xuchen¹,Han Xuefei²,Sarvey Thomas E.³,Green Craig E.²,Kottke Peter A.²,Fedorov Andrei G.²,Joshi Yogendra²,Bakir Muhannad S.³

Affiliation:

1. School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332 e-mail:

2. G. W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

3. School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30332

Abstract

This paper reports on novel thermal testbeds with embedded micropin-fin heat sinks that were designed and microfabricated in silicon. Two micropin-fin arrays were presented, each with a nominal pin height of 200 μm and pin diameters of 90 μm and 30 μm. Single-phase and two-phase thermal testing of the micropin-fin array heat sinks were performed using de-ionized (DI) water as the coolant. The tested mass flow rate was 0.001 kg/s, and heat flux ranged from 30 W/cm2 to 470 W/cm2. The maximum heat transfer coefficient reached was 60 kW/m2 K. The results obtained from the two testbeds were compared and analyzed, showing that density of the micropin-fins has a significant impact on thermal performance. The convective thermal resistance in the single-phase region was calculated and fitted to an empirical model. The model was then used to explore the tradeoff between the electrical and thermal performance in heat sink design.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4032496/6142034/ep_138_01_010910.pdf

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