Interconnect opportunities for gigascale integration-Reference-Cited by-同舟云学术

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Interconnect opportunities for gigascale integration

Published:2003-05 Issue:3 Volume:23 Page:28-35
ISSN:0272-1732
Container-title:IEEE Micro
language:en
Short-container-title:IEEE Micro

Author:

Meindl J.D.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx5/40/27221/01209464.pdf?arnumber=1209464

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