Affiliation:
1. State Key Laboratory of Integrated Service Networks, Xidian University
Publisher
Institute of Electronics, Information and Communications Engineers (IEICE)
Subject
Artificial Intelligence,Electrical and Electronic Engineering,Computer Vision and Pattern Recognition,Hardware and Architecture,Software
Reference30 articles.
1. [1] P. Darling, “Intel to invest more than $5 billion to build new factory in Arizona,” Feb. 18, 2011.
2. [2] J. Meindl, “Interconnect opportunities for gigascale integration,” IEEE Micro, vol.23, no.3, pp.28-35, May-June 2003. 10.1109/mm.2003.1209464
3. [3] T. Barwicz, H. Byun, F. Gan, C.W. Holzwarth, M.A. Popovic, P.T. Rakich, M.R. Watts, E.P. Ippen, F.X. Kartner, H.I. Smith, J.S. Orcutt, R.J. Ram, V. Stojanovic, O.O. Olubuyide, J.L. Hoyt, S. Spector, M. Geis, M. Grein, T. Lyszczarz, and J.U. Yoon, “Silicon photonics for compact, energy-efficient interconnects [Invited],” Journal of Optical Networking, vol.6, no.1, pp.63-73, 2007. 10.1364/jon.6.000063
4. [4] J. Jian, M. Lai, and L. Xiao, “A Fast Hierarchical Arbitration in Optical Network-on-Chip Based on Multi-Level Priority QoS,” IEICE Trans. Commun., vol.E99-B, no.4, pp.875-884, April 2016. 10.1587/transcom.2015ebp3382
5. [5] X. Han, Z. Zhang, J. Yang, H. Xiao, G. Ren, Y. Jiang, and Y. Tian, “On-chip switchable and reconfigurable optical mode exchange device using cascaded three-waveguide-coupling switches,” Optics Express, vol.28, no.7, pp.9552-9562, 2020.
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献