1. https://www.anandtech.com/tag/hbm2
2. https://newsroom.intel.com/wp-content/uploads/sites/11/2019/08/Intel-Lakefield-HotChips-presentation.pdf
3. D. Ingerly, S. Amin, L. Aryasomayajula, A. Balankutty, D. Borst, A. Chandra, K. Cheemalapati, C.S. Cook, R. Criss, K. Enamul, W. Gomes, D. Jones, K.C. Kolluri, A. Kandas, G.-S. Kim, H. Ma, D. Pantuso, C.F. Petersburg, M. Phen-Givoni, A.M. Pallai, A. Sairam, P. Shekhar, P. Sinha. P. Stover, A. Telang, Z. Zell, Foveros: 3D integration and the use of face to face stacking for logic devices, in IEDM 2019
4. A.A. Elsherbini, S.M. Liff, J.M. Swan, Heterogeneous integration using omni-directional interconnect packaging, in IEDM 2019
5. G. Moore, Cramming more components onto integrated circuits. Electronics 38(8), 114 (1965)