Bidirectional interlayer cooling of 3D chip stack for temperature uniformity enhancement and hotspot mitigation-Reference-Cited by-同舟云学术

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Bidirectional interlayer cooling of 3D chip stack for temperature uniformity enhancement and hotspot mitigation

Published:2024-07 Issue: Volume:248 Page:123254
ISSN:1359-4311
Container-title:Applied Thermal Engineering
language:en
Short-container-title:Applied Thermal Engineering

Author:

Li Xiu,Xuan Yimin

Publisher

Elsevier BV

Reference35 articles.

1. Cramming more components onto integrated circuits;Moore;Proc. IEEE,1998

2. The chips are down for Moore’s law;Waldrop;Nature,2016

3. Fabrication of doped ferrites and exploration of their structure and magnetic behavior;El-Shater;Mater. Adv.,2023

4. High-frequency absorption properties of gallium weakly doped barium hexaferrites;Trukhanov;Phil. Mag.,2019

5. Structural and dielectric characterization of synthesized nano-BSTO/PVDF composites for smart sensor applications;Hussein;Mater. Adv.,2023

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