Deformation Modeling Applied to Stress Relaxation of Four Solder Alloys

Abstract

Stress relaxation of four solder alloys, 50 percent Pb-50 percent In; 37.5 percent Sn-37.5 percent Pb-25 percent In; 63 percent Sn-37 percent Pb; and 62.5 percent Sn-37 percent Pb-0.5 percent Ag, has been examined at 222 K, 298 K, and 344 K. A model previously utilized to describe inelastic deformation of aluminum and stainless steels is applied and found to provide an excellent description of the experimental data. This model is based upon the general concept of stress assisted thermally activated dislocation glide in a microstructure evolving by the process of strain hardening and recovery. Model parameters useful for calculations of time dependent behavior of these solders are presented and their significance is discussed.