Author:
Woodmansee Michael W.,Neu Richard W.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference29 articles.
1. Solders in electronics
2. R. Berriche, S. Vaynman, M.E. Fine, D.A. Jeannotte, M.E. Nicholson, ASM Third Conf. Electronic Packaging: Materials and Processes and Corrosion in Microelectronics, Metals Park, OH, 1987, pp. 169–174.
3. Cavitation in a Pb/low-Sn solder during low cycle fatigue
4. High temperature deformation of the Pb-Sn eutectic
5. Deformation Modeling Applied to Stress Relaxation of Four Solder Alloys
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