Stress analysis of multi-layer electronic and mechanical systems (MEMS) under fatigue and impact loading conditions-Reference-Cited by-同舟云学术

Stress analysis of multi-layer electronic and mechanical systems (MEMS) under fatigue and impact loading conditions

Published:2010-12 Issue:4 Volume:6 Page:359-365
ISSN:1569-1713
Container-title:International Journal of Mechanics and Materials in Design
language:en
Short-container-title:Int J Mech Mater Des

Author:

Soliman Rasha Mohamed,El-Hadek Medhat Awad,Abdu Shaban Ibrahim

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/s10999-010-9143-1.pdf

Reference16 articles.

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3. Davies, B., Rodgers, S.M., Montague, S.: Design tools and issues of silicon micromachined (MEMS) devices. Proceedings of the Second International Conference on Engineering Design and Automation. Maui, Hawaii, 9–12 August (1998)

4. Diehl, T., Carroll, D.: Utilizing ABAQUS’ 10-node test for analysing impact problems involving thin-walled structures. Abaqus Users’ Conference Proceedings (2000)

5. Gad-el-Hak, M.: The MEMS Handbook, pp. 17–30. CRC Press LLC, New York (2002)

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