Affiliation:
1. Department of Mechanical Engineering, Stanford University, Stanford, CA 94305
Abstract
Peeling stress is experimentally shown to be an important factor for delamination in thermally mismatched bimaterial assembly. Strips of the plastic ULTEM-1000 and nickel alloy Kovar were attached with Devcon 14200 epoxy, and the temperature was raised from the stress-free curing temperature for one set of samples, and lowered for another set of samples, resulting in interfacial stresses. The samples that delaminated had the highest peeling stress.
Subject
Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Cited by
28 articles.
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