Thermal Stresses in a Bi-Layer Assembly in Electronics Packaging
Author:
Affiliation:
1. Lamar University,Department of Mechanical Engineering,Beaumont,TX,USA,77710
Funder
Lamar University
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10100701/10100725/10100842.pdf?arnumber=10100842
Reference24 articles.
1. Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies
2. Effects of Dwell Time and Ramp Rate on Lead-Free Solder Joints in FCBGA Packages;fan;Proceedings Electronic Components and Technology 2005 ECTC ’05,2005
3. Analysis of Bi-Metal Thermostats
4. Stress singularity analysis around the singular point on the stress singularity line in three-dimensional joints
5. Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips
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