Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies-Reference-Cited by-同舟云学术

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Interfacial shear stress, peeling stress, and die cracking stress in trilayer electronic assemblies

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Container-title:ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)
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Author:

Wang K.,Huang Y.,Chandra A.,Hu K.X.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6964/18752/00866171.pdf?arnumber=866171

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Stresses in a Bi-Layer Assembly in Electronics Packaging;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

2. Tension-Assisted Peeling;Modeling and Application of Flexible Electronics Packaging;2019

3. Theoretical and Experimental Studies of Competing Fracture for Flexible Chip-Adhesive-Substrate Composite Structure;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-01

4. Analysis of Interfacial Peeling of an Ultrathin Silicon Wafer Chip in a Pick-Up Process Using an Air Blowing Method;IEEE Transactions on Components, Packaging and Manufacturing Technology;2016-11

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