Analysis of Interfacial Peeling of an Ultrathin Silicon Wafer Chip in a Pick-Up Process Using an Air Blowing Method-Reference-Cited by-同舟云学术

Analysis of Interfacial Peeling of an Ultrathin Silicon Wafer Chip in a Pick-Up Process Using an Air Blowing Method

Published:2016-11 Issue:11 Volume:6 Page:1696-1702
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Jeon Eun-Beom,Park Sung-Hyeon,Yoo Yun-Sik,Kim Hak-Sung^ORCID

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

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