Instant, multiscale dry transfer printing by atomic diffusion control at heterogeneous interfaces-Reference-Cited by-同舟云学术

Instant, multiscale dry transfer printing by atomic diffusion control at heterogeneous interfaces

Published:2021-07-09 Issue:28 Volume:7 Page:
ISSN:2375-2548
Container-title:Science Advances
language:en
Short-container-title:Sci. Adv.

Author:

Heo Seungkyoung¹²^ORCID,Ha Jeongdae¹²^ORCID,Son Sook Jin³,Choi In Sun³^ORCID,Lee Hyeokjun¹²,Oh Saehyuck¹²,Jekal Janghwan¹²,Kang Min Hyung⁴,Lee Gil Ju⁴^ORCID,Jung Han Hee¹²,Yea Junwoo¹²,Lee Taeyoon⁵^ORCID,Lee Youngjeon²⁶,Choi Ji-Woong²⁷^ORCID,Xu Sheng⁸^ORCID,Choi Joon Ho²³^ORCID,Jeong Jae-Woong²⁹^ORCID,Song Young Min⁴^ORCID,Rah Jong-Cheol²³^ORCID,Keum Hohyun¹⁰^ORCID,Jang Kyung-In¹²³^ORCID

Affiliation:

1. Department of Robotics Engineering, Daegu Gyeongbuk Institute of Science and Technology, Daegu 42988, South Korea.

2. Brain Engineering Convergence Research Center, Daegu Gyeongbuk Institute of Science and Technology, Daegu 42988, South Korea.

3. Korea Brain Research Institute, Daegu 41062, South Korea.

4. School of Electrical Engineering and Computer Science, Gwangju Institute of Science and Technology, Gwangju 61005, South Korea.

5. Department of Electrical and Electronic Engineering, Yonsei University, Seoul 03722, South Korea.

6. National Primate Research Center, Korea Research Institute of Bioscience and Biotechnology, Cheongju, Chungcheongbuk-do 28116, South Korea.

7. Department of Information and Communication Engineering, Daegu Gyeongbuk Institute of Science and Technology, Daegu 42988, South Korea.

8. Department of Nanoengineering, University of California San Diego, La Jolla, CA 92093-0448, USA.

9. School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon 34141, South Korea.

10. Korea Institute of Industrial Technology, Cheonan, 31056 South Korea.

Abstract

Dry transfer printing by using atomic diffusion control enables multiscale and deterministic assembly of electronic devices.

Funder

Korean Government

This

R&D Program for Forest Science Technology Project

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

Reference42 articles.

1. Materials and Mechanics for Stretchable Electronics

2. Medium-scale carbon nanotube thin-film integrated circuits on flexible plastic substrates

3. High-performance thin-film transistors using semiconductor nanowires and nanoribbons

4. Extreme bendability of single-walled carbon nanotube networks transferred from high-temperature growth substrates to plastic and their use in thin-film transistors

5. An ultra-lightweight design for imperceptible plastic electronics

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