Investigation on the thermo-mechanical reliability of bump with different solder shape in ultra-large size FCBGA package
Author:
Affiliation:
1. ZTE Sanechips,Department of Packaging and Testing,Shenzhen,China
2. ZTE Corporation,State Key Laboratory of Mobile Network and Mobile Multimedia Technology,Shenzhen,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9872527/9872536/09873129.pdf?arnumber=9873129
Reference4 articles.
1. Effects of Peeling Stresses in Bimaterial Assembly
2. Interfacial delamination analysis at chip/underfill interface and investigation of its effect on flip-chip's reliability;xiang;International Conference on Electronic Packaging Technology,2013
3. Copper pillar shape and related stress simulation studies in flip chip packages;lee;Microelectronics and Packaging Conference(EMPC),2014
4. Copper pillar bump structure optimization for flip chip packaging with Cu/Low-K stack
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review;Micromachines;2024-03-22
2. Improvement of Warping Simulation Accuracy and Influence Factors Analysis in FCBGA Package;2024 Conference of Science and Technology for Integrated Circuits (CSTIC);2024-03-17
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