Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages-Reference-Cited by-同舟云学术

Optimization of Finned Heat Sinks for Impingement Cooling of Electronic Packages

Published:1998-09-01 Issue:3 Volume:120 Page:259-266
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Kondo Y.¹,Behnia M.²,Nakayama W.³,Matsushima H.¹

Affiliation:

1. Mechanical Engineering Research Laboratory, Hitachi, Ltd., Tsuchiura, Ibaraki 300, Japan

2. School of Mechanical and Manufacturing Engineering, The University of New South Wales, Sydney, NSW 2052, Australia

3. CALCE EPRC, Department of Mechanical Engineering, University of Maryland, College Park, MD 20742-7625

Abstract

The study of optimization of finned heat sinks for impingement cooling of electronic components was undertaken. The procedure was based on a semiempirical zonal approach to the determination of thermal resistance as well as pressure drop. To test the validity of the model’s predictions, experiments and CFD (computational fluid dynamics) simulations were performed. The results provided support for the approach. The model enables cost-effective design calculations to be performed for the optimization of heat sinks. We performed such calculations to optimize an LSI heat sink in consideration of sixteen design parameters, including fin thickness, fin spacing, fin height, and flow-orifice dimensions. For the particular application considered in our study, the optimum fin thickness was found to be 0.15 mm. The characteristics and limitations of air cooling for such applications were investigated under various conditions.

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/120/3/259/5882047/259_1.pdf

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