Design of an optimal heat-sink geometry for forced convection air cooling of Multi-Chip Modules-Reference-Cited by-同舟云学术

Design of an optimal heat-sink geometry for forced convection air cooling of Multi-Chip Modules

Published:1994 Issue: Volume: Page:267-276
ISSN:
Container-title:Thermal Management of Electronic Systems
language:
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Author:

Boesmans B.,Christiaens F.,Berghmans J.,Beyne E.

Publisher

Springer Netherlands

Link

http://link.springer.com/content/pdf/10.1007/978-94-011-1082-2_24.pdf

Reference6 articles.

1. Guyer E.C., Handbook of Applied Thermal Design, Mc-Graw Hill, NY, 1989.

2. Kakac S., Shah R.K., Aung W., Handbook of single-phase convecdve heat transfer, Wiley, NY, 1987.

3. Manglik R.M., Bergles A.E., “The thermal-hydraulic design of the rectangular offset-strip-fin heat exchanger”, in: Shah R.K., Kraus A.D., Metzger D. (eds.), Compact Heat Exchangers, Hemisphere, NY, 1990.

4. Claes D., Van Uytven G., Verbetering van de warmteoverdracht aan multichipmodules m.b.v. direkte luchtkoeling, thesis K.U.Leuven, TMEC/LWR/1991-1992/EE-01, 1992.

5. Zukauskas A., “Heat transfer from tubes in cross-flow”, Advances in Heat Transfer, vol. 8, Academic Press, NY, 1972.

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