Theoretical Investigation of a Pin Fin Heat Sink Performance for Electronic Cooling using Different Alloys Materials

Abstract

Abstract Electronic cooling plays a role in removing the electronic equipment’s heat rate to prevent failure from occurring. Electronic cooling performance is based on many parameters, such as thermal characteristics and material type design. Pure aluminium, copper – aluminium, and aluminium - beryllium are selected for predicting the performance of a heat sink. It was observed that the presence of Aluminium-copper alloy raises the performance of the heat sink compared with that of the pure aluminium. In contrast, the heat sink performance using aluminium - beryllium alloy was less than that of the reference material (pure aluminium). It was found that the heat dissipated from the heat sink increases by 1.4 % with using aluminium-copper alloy instead of using pure aluminium while the heat dissipated drops by 2% with using aluminium - beryllium alloy compared with that of using pure aluminium. Further, the heat sink mass decreases with the use of the aluminium-beryllium and increases with using copper - aluminium instead of pure aluminium. Whereas the mass of the heat sink using aluminium-copper alloy is higher than that of the pure aluminium by 2.3% while the mass of the heat sink using aluminium - beryllium alloy is less than that of the pure aluminium by 2.4%.