Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding-Reference-Cited by-同舟云学术

Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

Published:2018-08-06 Issue:4 Volume:140 Page:
ISSN:1043-7398
Container-title:Journal of Electronic Packaging
language:en
Short-container-title:

Author:

Wu Bo¹,Zhang Shuanghai¹,Wang Fuliang²,Chen Zhuo²

Affiliation:

1. State Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, HN Province, China

2. State Key Laboratory of High Performance Complex Manufacturing, School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, HN Province, China e-mail:

Abstract

The incorporation of a micro copper pillar is considered as the major interconnection method in three-dimensional (3D) integrated circuit (IC) intergradation under high-density I/O conditions. To achieve low-temperature bonding, this study investigated the thermosonic flip chip bonding of a copper pillar with a tin cap. The effect of bonding force on bonding strength was studied, and an average bonding strength 2500 g (approximately 84.8 MPa) was obtained in 2 s, at an optimized bonding force of 0.11 N per 40 μm pillar bump, and substrate temperature of 200 °C. Additionally, the effect of the bonding force on bonding interface microstructure and intermetallic compounds (IMCs) was also investigated. Tin whiskers were also observed at the bonding interface at low bonding forces.

Funder

National Natural Science Foundation of China

Publisher

ASME International

Subject

Electrical and Electronic Engineering,Computer Science Applications,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://asmedigitalcollection.asme.org/electronicpackaging/article-pdf/doi/10.1115/1.4040794/6368403/ep_140_04_044502.pdf

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