Process Parameters and Modeling Study of Thermosonic Flip Chip Bonding-Reference-Cited by-同舟云学术

Process Parameters and Modeling Study of Thermosonic Flip Chip Bonding

Published:2023-04 Issue:4 Volume:13 Page:545-552
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Wu Yongshuan¹^ORCID,Wang Pengkai¹^ORCID,Wu Tianxiang¹^ORCID,Xiao Jinqing¹^ORCID,Dou Long¹,Liu Zhan²^ORCID,Li Junhui¹^ORCID

Affiliation:

1. State Key Laboratory of High Performance Complex Manufacturing and the School of Mechanical and Electronical Engineering, Central South University, Changsha, China

2. Faculty of Intelligent Manufacturing and Joint Laboratory of Digital Optical Chip, Wuyi University, Jiangmen, China

Funder

National Natural Science Foundation of China

National Natural Science Foundation of China Joint Fund for Regional Innovation and Development

Youth Innovative Talents Project of Education Department of Guangdong Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/5503870/10140166/10108963.pdf?arnumber=10108963

Reference25 articles.

1. Interfacial Laser‐Induced Graphene Enabling High‐Performance Liquid−Solid Triboelectric Nanogenerator

2. Novel Functionalized BN Nanosheets/Epoxy Composites with Advanced Thermal Conductivity and Mechanical Properties

3. Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding

4. Optimization of gold bump thermosonic flip chip bonding process parameters;yang;Electron Compon Mater,2019

5. New Applications of an Automated System for High-Power LEDs

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