3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

Published:2008-11 Issue:6 Volume:52 Page:611-622
ISSN:0018-8646
Container-title:IBM Journal of Research and Development
language:
Short-container-title:IBM J. Res. & Dev.

Author:

Sakuma K.,Andry P. S.,Tsang C. K.,Wright S. L.,Dang B.,Patel C. S.,Webb B. C.,Maria J.,Sprogis E. J.,Kang S. K.,Polastre R. J.,Horton R. R.,Knickerbocker J. U.

Publisher

IBM

Subject

General Computer Science

Link

http://xplorestaging.ieee.org/ielx5/5288520/5388557/05388567.pdf?arnumber=5388567

Cited by 107 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An innovative high-entropy alloy solder for high-reliability low-temperature bonding in 3D electronic packaging–based on nano InSnBiZnAg particles;Journal of Materials Research and Technology;2024-05

2. RF Modelling of for Through SiC Vias and Fabrication of SiC based Interposer;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

3. IBM T.J. Watson Research Centerでの三次元チップレット集積化技術開発への挑戦;Journal of The Japan Institute of Electronics Packaging;2023-09-01

4. Integration and Packaging for Water Monitoring Systems;Sensing Technologies for Real Time Monitoring of Water Quality;2023-08-31

5. Voids-free Die-level Cu/ILD Hybrid bonding;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP