Automated Layout Generation and Wiring Area Estimation for 3D Electronic Modules-Reference-Cited by-同舟云学术

Automated Layout Generation and Wiring Area Estimation for 3D Electronic Modules

Published:1999-05-01 Issue:3 Volume:123 Page:330-336
ISSN:1050-0472
Container-title:Journal of Mechanical Design
language:en
Short-container-title:

Author:

Scha¨fer Mike¹,Lengauer Thomas²¹

Affiliation:

1. University of Bonn, Department of Computer Science, Ro¨merstraße 164, 53117 Bonn

2. GMD National Research Center for Information Technology, Institute for Algorithms and Scientific Computing, Schloß Birlinghoven, 53754 Sankt Augustin

Abstract

This paper presents an integrated approach to the layout generation of 3D rectagonal objects and wiring area estimation. Problems of this type are encountered in various component layout tasks such as the space-efficient placement of electronic components in automobiles. The goal is to achieve high packing densities and fitting of objects in predefined design spaces while satisfying spatial constraints. The layout problem is formulated as mixed integer linear program and can be solved either by a branch&bound procedure or heuristically. The wiring area estimation is integrated in the problem formulation on the basis of a number of explicit wiring variants for each cable.

Publisher

ASME International

Subject

Computer Graphics and Computer-Aided Design,Computer Science Applications,Mechanical Engineering,Mechanics of Materials

Link

http://asmedigitalcollection.asme.org/mechanicaldesign/article-pdf/123/3/330/5500258/330_1.pdf

Reference21 articles.

1. Bischoff, E. E., and Wa¨scher, G., editors, 1995, EJOR; Special Issue on Cutting and Packing, 84, Elsevier.

2. Lengauer, T., 1990, Combinatorial Algorithms for Integrated Circuit Layout, Applicable Theory in Computer Science, Wiley-Teubner, Chichester-Stuttgart.

3. Lengauer, T. and Mu¨ller, R., 1993, “Robust and Accurate Hierarchical Floorplanning With Integrated Global Wiring,” IEEE Trans. Comput.-Aided Des. Integrated Circuits and Systems,12, No. 6, pp. 802–809.

4. Kolli, A., Cagan, J., and Rutenbar, R., 1996, “Packing of Generic, Three-Dimensional Components Based on Multi-Resolution Modeling,” Proc. R. Soc. London, Ser. A.

5. Szykman, S., and Cagan, J., 1997, “Constrained Three-Dimensional Component Layout Using Simulated Annealing,” ASME J. Mech. Des., 119, No. 1, pp. 28–35.

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Machine Learning Surrogates for Optimal 2D Spatial Packaging of Interconnected Systems with Physics Interactions (SPI2);AIAA AVIATION 2023 Forum;2023-06-08

2. Toward Holistic Design of Spatial Packaging of Interconnected Systems With Physical Interactions (SPI2);Journal of Mechanical Design;2022-08-26

3. Underhood Spatial Packing and Routing of an Automotive Fuel Cell System (AFCS) Using 2D Geometric Projection;AIAA SCITECH 2022 Forum;2022-01-03

4. Multi-Branch Cable Harness Layout Design Based on Genetic Algorithm with Probabilistic Roadmap Method;Chinese Journal of Mechanical Engineering;2021-03-18

5. A Novel Two-Stage Design Framework for Two-Dimensional Spatial Packing of Interconnected Components;Journal of Mechanical Design;2020-11-10