Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates
Author:
Affiliation:
1. Department of Materials Science and Engineering, National Dong Hwa University
2. Central Labs, Advanced Semiconductor Engineering, Inc.
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/50/5/50_M2009016/_pdf
Reference11 articles.
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2. 2) W. Peng and M. E. Marques: J. Electron. Mater. 36 (2007) 1679–1690.
3. 3) Y. Xia, C. Lu and X. Xie: J. Electron. Mater. 36 (2007) 1129–1136.
4. 4) W. C. Oliver and G. M. Pharr: J. Mater. Res. 7 (1992) 1564–1580.
5. 5) C. Fisher-Cripps: Nanoindentation, 2nd ed., (Springer-Verlag, New York, 2004) p. 146.
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