Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging-Reference-Cited by-同舟云学术

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Utilizing Co as a contact metallization for wafer-level Cu-Sn-In SLID bonding used in MEMS and MOEMS packaging

Published:2022-09-13 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
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Author:

Emadi Fahimeh¹,Vuorinen Vesa¹,Paulasto-Krockel Mervi¹

Affiliation:

1. Aalto University,Department of Electrical Engineering and Automation,Espoo,Finland

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9939139/9939378/09939539.pdf?arnumber=9939539

Reference33 articles.

1. Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates

2. Nanomechanical Responses of an Intermetallic Compound Layer in Transient Liquid Phase Bonding Using Indium

3. Plasticity characteristic obtained through hardness measurement

4. Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

5. Microstructure Evolution of Cu/In/Cu Joints After Solid-Liquid Interdiffusion

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel Low-Temperature Interconnects for 2.5-/3-D MEMS Integration: Demonstration and Reliability;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08

2. Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics;Materials Science and Engineering: A;2023-08

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