Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling-Reference-Cited by-同舟云学术

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

Published:2008-03-06 Issue:6 Volume:37 Page:829-836
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Wong E.H.,Selvanayagam C.S.,Seah S.K.W.,van Driel W.D.,Caers J.F.J.M.,Zhao X.J.,Owens N.,Tan L.C.,Frear D.R.,Leoni M.,Lai Y.-S.,Yeh C.-L.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-008-0403-x.pdf

Reference15 articles.

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4. E.H. Wong, K.M. Lim, N. Lee, S. Seah, C. Koh, and J. Wang, Proceedings of the 4th Electronic Packaging & Technology Conference (Singapore, 2002), pp. 327–333

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