Author:
Honarvar Sobhan,Nourani Amir,Karimi Mojtaba
Subject
Applied Mathematics,Mechanical Engineering,Condensed Matter Physics,General Materials Science
Reference39 articles.
1. Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints;Thompson;Eng. Fract. Mech.,2018
2. “Idle, Normal and Max CPU Temperatures,” 2019. [Online]. Available: http://www.buildcomputers.net/cpu-temperature.html.
3. S. P. V Nadimpalli and J. K. Spelt, “Mixed-mode fracture load prediction in lead-free solder joints,” Eng. Fract. Mech., vol. 78, no. September 2010, pp. 317–333, 2011.
4. S. P. V Nadimpalli and J. K. Spelt, “Fracture load prediction of lead-free solder joints,” Eng. Fract. Mech., vol. 77, no. September 2010, pp. 3446–3461, 2010.
5. S. P. V. Nadimpalli and J. K. Spelt, “R-curve behavior of Cu-Sn3.0Ag0.5Cu solder joints: Effect of mode ratio and microstructure,” Mater. Sci. Eng. A, vol. 527, no. August 2009, pp. 724–734, 2010.
Cited by
5 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献