Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders-Reference-Cited by-同舟云学术

Effect of Specimen Size and Aging on Tensile Properties of Sn-Ag-Cu Lead-Free Solders

Published:2008 Issue:5 Volume:49 Page:1175-1179
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Shohji Ikuo¹,Osawa Tsutomu¹,Matsuki Takashige²,Kariya Yoshiharu³,Yasuda Kiyokazu⁴,Takemoto Tadashi⁵

Affiliation:

1. Graduate School of Engineering, Gunma University

2. Faculty of Engineering, Gunma University

3. Faculty of Engineering, Shibaura Institute of Technology

4. Graduate School of Engineering, Osaka University

5. Joining and Welding Research Institute, Osaka University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/49/5/49_MBW200705/_pdf

Reference12 articles.

1. 1) S. Ganesan and M. Pecht: Lead-free Electronics (Wiley-Interscience publication, 2006).

2. 2) I. Shohji, T. Yoshida, T. Takahashi and S. Hioki: Mater. Sci. Eng. A 366 (2004) 50–55.

3. 3) I. Shohji, T. Yoshida, T. Takahashi and S. Hioki: J. Mater. Sci.: Materials in Electronics 15 (2004) 219–223.

4. 4) I. Shohji, K. Yasuda and T. Takemoto: Mater. Trans. 46 (2005) 2329–2334.

5. 5) Y. Kariya, T. Asai, T. Suga and M. Otsuka: Proc. 10th Symposium on Microjoining and Assembly Technology in Electronics, (The Japan Welding Society, 2004) pp. 61–64.

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