Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process
Author:
Affiliation:
1. Joining and Welding Research Institute, Osaka University
2. Graduate School of Engineering, Osaka University
Publisher
Japan Institute of Metals
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Link
https://www.jstage.jst.go.jp/article/matertrans/56/7/56_MI201421/_pdf
Reference14 articles.
1. 1) M. O. Alam, Y. C. Chan and K. N. Tu: J. Appl. Phys. 94 (2003) 7904–7909.
2. 2) P. Y. Yeh, J.-M. Song and K.-L. Lin: J. Electron. Mater. 35 (2006) 978–987.
3. 3) T. Takemoto, T. Uetani and M. Yamazaki: Solder. Surf. Mount Technol. 16 (2004) 9–15.
4. 4) H. Nishikawa, T. Takemoto, K. Kifune, T. Uetani and N. Sekimori: Mater. Trans. 45 (2004) 741–746.
5. 5) T. Daito, H. Nishikawa, T. Takemoto and T. Matsunami: Microelectron. Reliab. 53 (2013) 2005–2011.
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