Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder-Reference-Cited by-同舟云学术

Effect of Iron Plating Conditions on Reaction in Molten Lead-Free Solder

Published:2004 Issue:3 Volume:45 Page:741-746
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Nishikawa Hiroshi¹,Takemoto Tadashi¹,Kifune Kouichi²,Uetani Takashi³,Sekimori Norihisa³

Affiliation:

1. Collaborative Research Center for Advanced Science and Technology, Osaka University

2. Department of Environmental Sciences, Faculty of Sciences, Osaka Women’s University

3. Hakko Corporation

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/45/3/45_3_741/_pdf

Reference18 articles.

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2. 2) B.R. Allenby, J.P. Ciccarelli, I. Artaki, J.R. Fisher, D. Schoenthaler, T.A. Carroll, D.W. Dahringer, Y. Degani, R.S. Freund, T.E. Graedel, A.M. Lyons, J.T. Plewes, C. Gherman, H. Solomon, C. Melton and et al.: Circuit World 19 (1993) 25-31.

3. 3) T. Takemoto: Materia Japan 35 (1996) 320-325.

4. 4) T. Takemoto: J. Japan Weld Soc. 69 (2000) 100-107.

5. 5) T. Takemoto and M. Miyazaki: Mater. Trans. 42 (2001) 745-750.

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