Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test-Reference-Cited by-同舟云学术

Effect of Excess Temperature above Liquidus of Lead-Free Solders on Wetting Time in a Wetting Balance Test

Published:2001 Issue:5 Volume:42 Page:745-750
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Takemoto Tadashi¹,Miyazaki Makoto¹

Affiliation:

1. Collaborative Research Center for Advanced Science and Technology, Osaka University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/42/5/42_5_745/_pdf

Reference18 articles.

1. 1) R. Strauss: Surface Mount Technology, (Butterworth-Heineman Ltd., Oxford, 1994) pp. 10–22.

2. 2) C. Lea: A Scientific Guide to Surface Mount Technology, (Electrochem. Pub. Ltd., Scotland, 1988) pp. 6–41.

3. 3) R. J. Klein Wassink: Soldering in Electronics, 2nd Edn., (Electrochem. Pub. Ltd., Scotland, 1989) pp. 10–15.

4. 4) B. R. Allenby, J. P. Ciccarelli, I. Artaki, J. R. Fisher, D. Schoenthaler, T. A. Carroll, D. W. Dahringer, Y. Degani, R. S. Freund, T. E. Graedel, A. M. Lyons and J. T. Plewes: Circuit World 19 (1993) 18–24.

5. 6) P. G. Harris and M. A. Whitemore: Circuit World 19 (1993) 25–27.

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