Dissolution rates of iron plating on soldering iron tips in molten lead‐free solders-Reference-Cited by-同舟云学术

Dissolution rates of iron plating on soldering iron tips in molten lead‐free solders

Published:2004-12 Issue:3 Volume:16 Page:9-15
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Takemoto Tadashi,Uetani Takashi,Yamazaki Morio

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference15 articles.

1. Bader, W.G. (1969), “Dissolution of Au, Ag, Pd, Pt, Cu and Ni in a molten tin‐lead solder”, Welding Journal, Vol. 48, pp. 551‐5.

2. Berg, H. and Hall, E.L. (1973), “Dissolution rate and reliability effects of gold, silver, nickel and copper in lead base solders”, Annual IEEE Proc. Reliability Phys., Vol. 11, pp. 10‐20.

3. Bulwith, R.A. and Mackay, C.A. (1985), “Silver scavenging inhibition of some silver loaded solders”, Weld. J., Vol. 64 No. 3.

4. The System Iron--Tin: Liquidus Only

5. Lead‐free reflow soldering for electronics assembly

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