Explanation of impact load curve in ball impact test in relation to thermal aging-Reference-Cited by-同舟云学术

Explanation of impact load curve in ball impact test in relation to thermal aging

Published:2013-12 Issue:12 Volume:53 Page:2005-2011
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Daito Tomoya,Nishikawa Hiroshi,Takemoto Tadashi,Matsunami Takashi

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference23 articles.

1. Effect of surface finish on the fracture behavior of Sn-Ag-Cu solder joints during high-strain rate loading;You;J Alloys Compd,2009

2. Effect of specimen size and aging on tensile properties of Sn–Ag–Cu lead-free solders;Shohji;Mater Trans,2008

3. Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester;Xu;J Mater Res,2008

4. Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition;Lai;Microelectron Reliab,2006

5. JEDEC standard no. 22-B111. Board level drop test method of components for handheld electronic products. Arlington: JEDEC Solid State Technology Association; 2002.

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Highly efficient soldering of Sn-Ag-Cu solder joints using blue laser;Journal of Manufacturing Processes;2022-10

2. Soldering Process;Novel Structured Metallic and Inorganic Materials;2019

3. Load Sharing Between Discrete Solder Joints in Bending: Effect of Spacing and Joint Properties;IEEE Transactions on Device and Materials Reliability;2016-09

4. A Novel Method for Impact Testing of Small Specimens - Numerical Simulation and Experiments;Experimental Mechanics;2015-04-23

5. Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process;MATERIALS TRANSACTIONS;2015