Copper Materials for Low Temperature Sintering-Reference-Cited by-同舟云学术

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Copper Materials for Low Temperature Sintering

Published:2022-05-01 Issue:5 Volume:63 Page:663-675
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Nishimoto Masamu¹,Tokura Rintaro¹,Nguyen Mai Thanh¹,Yonezawa Tetsu¹

Affiliation:

1. Division of Materials Science and Engineering, Faculty of Engineering, Hokkaido University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/63/5/63_MT-N2021004/_pdf

Reference56 articles.

1. 1) W. Wu: Nanoscale 9 (2017) 7342–7372. doi:10.1039/C7NR01604B

2. 2) C. Luo, C. Xu, L. Lv, H. Li, X. Huang and W. Liu: RSC Adv. 10 (2020) 8385–8395. doi:10.1039/C9RA08977B

3. 3) S. Tanaka and H. Nishimura: Butsuri Kyoiku 50 (2002) 237–242. doi:10.20653/pesj.50.4_237

4. 4) V. Engels, F. Benaskar, D.A. Jefferson, B.F.J. Johnson and A.E.H. Wheatley: Dalton Trans. 39 (2010) 6496–6502. doi:10.1039/c0dt00134a

5. 5) Y. Kobayashi and T. Sakuraba: Colloids Surf. A 317 (2008) 756–759. doi:10.1016/j.colsurfa.2007.11.009

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