Effect of Texture and Grain Size on the Deformation Behavior of Sputtered Thick Al-Si Films during Cyclic Heating and Cooling-Reference-Cited by-同舟云学术

Effect of Texture and Grain Size on the Deformation Behavior of Sputtered Thick Al-Si Films during Cyclic Heating and Cooling

Published:2011 Issue:1 Volume:52 Page:102-107
ISSN:1345-9678
Container-title:MATERIALS TRANSACTIONS
language:en
Short-container-title:Mater. Trans.

Author:

Kurosu T.¹²,Shimizu Y.²,Tomota Y.³,Onuki J.⁴

Affiliation:

1. Power and Industrial Division, Hitachi Ltd.

2. Graduate School of Science and Engineering, Ibaraki University

3. Institute of Applied Beam Science, Graduate School of Science and Engineering/Frontier Research Center for Applied Atomic Sciences, Ibaraki University

4. Department of Materials Science, Faculty of Engineering, Ibaraki University

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://www.jstage.jst.go.jp/article/matertrans/52/1/52_M2010308/_pdf

Reference8 articles.

1. 1) J. Onuki, M. Koizumi and M. Suwa: IEEE Trans. Adv. Packag. 23 (2000) 108.

2. 2) Handbook of Physical Properties (in Japanese), (Asakura Press, 1978) p. 124.

3. 3) Y. Shimizu, Y. Tomta, J. Onuki, K. P. Khoo and T. Kurosu: Jpn. J. Appl. Phys. 48 (2009) 066511.

4. 4) I. Dutta, M. W. Cohen, K. Peterson and T. Shultz: J. Electron. Mater. 30 (2001) 1537.

5. 5) C. Park, I. Dutta, K. A. Peterson and J. Vella: J. Electron. Mater. 32 (2003) 1059.

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